ACM Research Announces Shipment of Its First 310 × 310 mm Ultra ECP ap-p Panel-Level Horizontal Electroplating Production Tool
Key Highlights
- ➤First 310 × 310 mm Ultra ECP ap-p production tool shipped to an Asian customer
- ➤Shipment expands ACM Research’s panel-level packaging platform beyond mainland China
- ➤Tool supports copper, nickel, tin-silver and gold plating processes
- ➤System targets tall 300-micron copper pillars with high plating rates
- ➤ACM says proprietary technology positions it for AI-driven advanced packaging demand
Expert Statements
Dr. David Wang, President and Chief Executive Officer of ACM Research
“This is an important milestone for ACM’s advanced packaging efforts, and marks shipment of what we believe is the world's first 310 × 310 mm panel-level horizontal electroplating production tool to a customer in Asia”
Dr. David Wang, President and Chief Executive Officer of ACM Research
“We believe our proprietary horizontal plating technology is uniquely positioned to enable the next generation of advanced semiconductor packaging across multiple panel sizes and emerging packaging architectures.”
Dr. David Wang, President and Chief Executive Officer of ACM Research
“As AI drives increasingly complex packaging requirements, we see a significant long-term opportunity for ACM to play an enabling role in this rapidly evolving market.”
FREMONT, Calif., Oct. 28, 2026 (GLOBE NEWSWIRE) -- ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced packaging applications, today announced the shipment of its first 310 × 310 mm Ultra ECP ap-p panel-level horizontal electroplating production system to a customer in Asia outside mainland China. The shipment marks another significant advance in ACM's core panel-level technologies and represents an important step forward in broadening its multi-product platform and expanding its global customer presence.
As advanced packaging technologies continue to evolve, panel-level processing is gaining traction across the industry for its ability to accommodate larger substrates. Electroplating is one of the most critical steps in advanced packaging manufacturing, where equipment stability, plating thickness uniformity and consistency are essential to successful process integration, product yield and manufacturing efficiency. The newly shipped tool is designed for 310 × 310 mm panel-level applications, and demonstrates ACM's ability to quickly advance product development per customer requirements. This follows last year’s shipment of ACM’s first 515 × 510 mm R&D tool, highlighting ACM's ability to rapidly commercialize technical breakthroughs into scale production.
Get started
Create a free account to read the full story.