ACM Research Expands Ultra C Tahoe into a Wet Processing Platform

FREMONT, Calif., Aug. 07, 2026 (GLOBE NEWSWIRE) -- ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer and panel processing solutions for semiconductor and advanced packaging applications, today announced that it has expanded its Ultra C Tahoe system into a multi-process wet processing platform with new process applications that support a broader range of advanced wet processing applications for logic and memory device manufacturing. The expanded platform has been adopted by multiple leading semiconductor manufacturers, demonstrating its production readiness, versatility and scalability for advanced semiconductor manufacturing.

Leveraging ACM's proprietary hybrid wet processing technology, the Ultra C Tahoe platform integrates batch and single wafer processes into a common architecture, enabling multiple advanced wet processes to be performed on a single platform. The platform fully leverages the advantages of batch cleaning, supporting longer process times and reducing chemical consumption, while also delivering the key benefits of single-wafer cleaning, including high particle removal efficiency, significantly reduced cross-contamination between wafers, and precise process time control. Recycle monitor wafer reclaim processing capabilities were recently added to the Ultra C Tahoe platform for advanced process node. The Ultra C Tahoe system leverages the hybrid architecture to consolidate multiple processing steps previously performed on separate tools into a single hybrid platform. This reduces wafer transfers between tools and shortens cycle time, while delivering improved particle removal performance and higher throughput.