ACM Research’s Ultra ECP ap-p Horizontal Panel Electroplating Tool Receives First Production Order and Evaluation Order from Customers

FREMONT, Calif., Aug. 07, 2026 (GLOBE NEWSWIRE) -- ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer and panel processing solutions for semiconductor and advanced packaging applications, today announced it has received orders for its proprietary Ultra ECP ap-p horizontal panel-level electroplating tool from two advanced packaging customers. This includes orders for: * The first production order for one 510 × 515 mm Ultra ECP ap-p tool from an existing advanced packaging customer in mainland China, with delivery scheduled for the first half of 2027; and * An evaluation order for one 310 × 310 mm Ultra ECP ap-p tool from a new leading panel-manufacturer customer based in Asia, with delivery scheduled for the fourth quarter of 2026. We believe our Ultra ECP ap-p represents the world’s first commercial horizontal panel-level copper deposition system for large panel market, supporting plating steps across pillar, bump and redistribution layer (RDL) processes. These orders broaden market reach of the Ultra ECP ap-p, support the expansion of ACM’s global customer base, and further strengthen ACM’s position in the panel-level advanced packaging equipment market.