Applied Materials and Intel Collaborate to Accelerate Chipmaking Innovations for AI-Driven Computing
Key Highlights
- ➤Applied Materials and Intel collaborate on next-generation AI chipmaking technologies
- ➤Work targets advanced transistors, interconnects and packaging for AI workloads
- ➤Collaboration includes Foveros-based 3D stacking with denser interconnects and improved power delivery
- ➤Applied’s EPIC Center is scheduled to be operationally ready this year
- ➤Teams aim to shorten development cycles and accelerate transfer to high-volume manufacturing
Expert Statements
Gary Dickerson, President and CEO of Applied Materials
“Applied and Intel share a decades-long history of deep collaboration focused on pushing the boundaries of materials engineering to advance the semiconductor roadmap.”
Gary Dickerson, President and CEO of Applied Materials
“Bringing our teams together at the EPIC Center will deepen that partnership and accelerate the transistor, interconnect and packaging innovations needed to drive the future of AI computing.”
Lip-Bu Tan, CEO of Intel
“The demand for AI computing is driving the need for major advances in performance, power efficiency, and packaging.”
Lip-Bu Tan, CEO of Intel
“Intel is focused on delivering those innovations and doing it in close collaboration with partners across the ecosystem.”
Lip-Bu Tan, CEO of Intel
“Applied Materials is an important partner, and we look forward to expanding our work together at the EPIC Center to help accelerate the path from the lab to high-volume manufacturing in the United States.”
Dr. Prabu Raja, President of the Semiconductor Products Group at Applied Materials
“With the chipmaking roadmap becoming more complex at each process node, accelerating innovations in semiconductor devices, interconnects and packaging requires deeper collaboration across R&D and manufacturing.”
Dr. Prabu Raja, President of the Semiconductor Products Group at Applied Materials
“We look forward to working closely with Intel as a founding partner of the EPIC Center to shorten development cycles and bring new technologies to market faster.”
Naga Chandrasekaran, Executive Vice President, Chief Technology and Operations Officer and General Manager of Intel Foundry
“Accelerating our R&D to keep pace with the rapid buildout of AI infrastructure is critical to delivering the technology, manufacturing excellence and foundry services our customers expect from Intel Foundry.”
Naga Chandrasekaran, Executive Vice President, Chief Technology and Operations Officer and General Manager of Intel Foundry
“Applied Materials’ new EPIC Center provides an environment where our teams can collaborate even more closely and at higher velocity to accelerate materials development and process innovations.”
* Collaborations at Applied’s EPIC Center in Silicon Valley and Intel’s R&D campus in Oregon aim to develop breakthroughs in next-generation transistors, interconnects and advanced packaging technologies for AI chips and systems * Collaboration builds on the companies’ long history of working together to solve complex semiconductor device scaling challenges SANTA CLARA, Calif., Oct. 06, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc. (Nasdaq: AMAT), the leader in materials engineering for the semiconductor industry, today announced it is working with Intel Corporation (Nasdaq: INTC) to accelerate development of chipmaking innovations for next-generation transistors, interconnects and advanced packaging technologies. The collaboration will bring together cutting-edge capabilities from Applied’s EPIC Center in Silicon Valley and Intel’s R&D campus in Hillsboro, Oregon to shorten time-to-market of advanced semiconductor technologies essential to AI computing.
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