Applied Materials to Increase its Strategic Investment in BE Semiconductor Industries
Key Highlights
- ➤Applied Materials to raise Besi stake to approximately 20% of outstanding shares
- ➤Share purchase uses an accelerated agreement, pending applicable HSR Act waiting period
- ➤Expanded collaboration targets 3D IC scaling, logic-memory integration and advanced bonding platforms
- ➤Applied currently has no intention to exceed approximately 20% ownership or seek Besi board representation
Expert Statements
Dr. Prabu Raja, President of the Semiconductor Products Group at Applied Materials
“Applied Materials is adding to its investment in Besi as hybrid bonding technology and next-generation interconnect architectures become increasingly critical enablers of energy-efficient AI compute performance”
Dr. Prabu Raja, President of the Semiconductor Products Group at Applied Materials
“We also look forward to furthering our strategic collaboration with Besi and delivering the innovative products and technologies our customers need to scale AI systems.”
SANTA CLARA, Calif., Oct. 26, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc. (Nasdaq: AMAT) today announced it is increasing its investment in BE Semiconductor Industries N.V. (Besi) (Euronext Amsterdam: BESI), a leading manufacturer of assembly equipment for the semiconductor industry, to approximately 20 percent of Besi’s outstanding shares. The share purchase would add to Applied Materials’ current investment in Besi, which Applied initially made in April 2025.
The companies have a longstanding strategic collaboration, which began in 2020 and was recently expanded with Besi joining Applied Materials’ EPIC Center as an Innovation Partner. The expanded partnership extends the companies’ co-innovation beyond hybrid bonding into new interconnect architectures and applications supporting the semiconductor industry’s AI-driven scaling roadmap. Areas of collaboration include next-generation 3D IC scaling, logic and memory integration, scaling of thermo-compression bonding and new die-on-wafer, die-on-die and die-on-panel integration platforms.
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