Broadcom Redefines AI Infrastructure with Industry-Leading Networking Innovations at 2026 OCP Global Summit
Key Highlights
- ➤Broadcom will showcase AI networking innovations at the October 12–15 OCP Global Summit
- ➤Portfolio includes Tomahawk 6, Thor Ultra 800G, and third-generation TH6-Davisson CPO
- ➤Keynote will outline infrastructure designs for AI clusters exceeding 100,000 accelerators
- ➤Broadcom will partner with 15 plus companies on demonstrations across the show floor
Expert Statements
Charlie Kawwas, President, Semiconductor Solutions Group, Broadcom
“Together, the OCP Community and Broadcom have a long history of driving computing at massive scale, and this year’s event theme—'Scaling Innovation for the AI Era'—underscores the growing importance of open collaboration. AI infrastructure demands are scaling faster than anything our industry has seen, and Ethernet is the foundation that makes that growth sustainable. With our industry-leading portfolio of networking solutions and new breakthroughs in integrated optics, Broadcom is giving AI labs, hyperscalers and cloud providers the bandwidth and power efficiency they need to scale-up, scale-out, and scale-across next-generation AI clusters”
George Tchaparian, CEO, Open Compute Project Foundation
“The current pace of AI data center infrastructure development depends on an open ecosystem that can support rapid innovation. The OCP Foundation with its unique collaborative model, Chip-to-Grid vision, and large collaborative community is the perfect place to nurture open ecosystems for the rapidly evolving AI data center industry. Broadcom has been a longstanding contributor to OCP, and we appreciate the technologies and contributions they're bringing to this year's Summit that leverage the open collaborations of the OCP Community, from ORV3 rack-based designs to advances in ORW (wide) racks and new wide co-packaged optics, that reflect exactly the kind of collaboration our Community needs to solve the bandwidth and efficiency challenges facing AI data centers at scale”
PALO ALTO, Calif., Oct. 08, 2026 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO), a global technology leader that designs, develops, and supplies semiconductor and infrastructure software solutions, today announced it is set to present its latest innovations in scale-up, scale-out, and scale-across AI networking at the 2026 Open Compute Project (OCP) Global Summit. Running from October 12–15 in San Jose, Broadcom will feature Ethernet switches, NICs, PCIe components and integrated optics to power Open Rack Version 3 (ORV3) solutions for scaling AI infrastructure.
Featured innovations include Tomahawk(®) 6, Tomahawk Ultra, and Jericho 4 Ethernet switches, the Thor Ultra 800G and Thor 2 400G AI Ethernet NICs, and Broadcom's third-generation TH6-Davisson Co-Packaged Optics (CPO) — a portfolio built to meet the exponential bandwidth demands of frontier AI models as they grow in scale and complexity.
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