Celestica Introduces the DS6005 Data Center Switch with Co-Packaged Optics to Enable Power-Efficient AI Fabrics

Gavin Cato, SVP & GM Portfolio Solutions & AI Platform Engineering, Celestica

“AI infrastructure is driving unprecedented demand for bandwidth, while power, thermal management, latency, and reach are becoming increasingly important constraints”

Gavin Cato, SVP & GM Portfolio Solutions & AI Platform Engineering, Celestica

“The DS6005 brings co-packaged optics, liquid cooling, field-replaceable external laser modules, and CPO-aware software management together in a compact platform designed to help customers build scalable and power-efficient AI fabrics.”

Manish Mehta, Vice President of Marketing and Operations, Optical Systems Division, Broadcom

“Moving co-packaged optics from an advanced architecture to a production-ready system requires collaboration across silicon, optical engines, packaging, thermal design, manufacturing, and system integration.”

Manish Mehta, Vice President of Marketing and Operations, Optical Systems Division, Broadcom

“By combining Broadcom’s Tomahawk 6 – Davisson platform and optical expertise with Celestica’s system engineering and platform execution, the DS6005 demonstrates how our partnership is helping bring CPO to market for AI networking.”

Manish Mehta, Vice President of Marketing and Operations, Optical Systems Division, Broadcom

“Celestica’s work has been instrumental in translating our technology into a platform designed for high-density AI fabrics.”

Sameh Boujelbene, Vice President of Research, Dell’Oro Group

“AI networking is shifting the constraint from compute to the physical infrastructure around it, where power, density, reach, and deployment complexity increasingly matter.”

Sameh Boujelbene, Vice President of Research, Dell’Oro Group

“Co-packaged optics is one of the industry’s important paths to address these challenges, while pluggable, near-package, and co-packaged approaches will continue to coexist as the ecosystem matures.”

Sameh Boujelbene, Vice President of Research, Dell’Oro Group

“Celestica’s DS6005 is a meaningful example of how the industry is beginning to apply CPO to high-density AI networking, giving operators another option as they scale AI fabrics.”

Alan Weckel, Founder and Technology Analyst, 650 Group

“Co-packaged optics is moving from an industry theme toward production for AI networking, with an important near-term opportunity in controlled, high-density scale-out fabrics.”

Alan Weckel, Founder and Technology Analyst, 650 Group

“By placing optical engines close to the switch silicon and combining CPO with liquid cooling, the technology can improve power efficiency and reliability while supporting the reach and radix requirements of AI factories.”

Alan Weckel, Founder and Technology Analyst, 650 Group

“Celestica’s DS6005 shows how collaboration across silicon, systems, and manufacturing is translating CPO into deployable infrastructure.”

Cliff Grossner, Chief Innovation Officer, Open Compute Project Foundation

“Open collaboration is essential to moving co-packaged optics technology toward scalable, reliable, and widely-deployed open platform solutions for AI infrastructure.”

Cliff Grossner, Chief Innovation Officer, Open Compute Project Foundation

“By fostering open approaches across silicon photonics, hardware, software, and management, the OCP Foundation and Community help advance interoperable AI fabrics that can be deployed and supported at scale.”