Credo to Showcase Broad Portfolio of Connectivity Solutions for AI Scale-Out and Scale-Up Fabrics at 2026 OCP Global Summit
Key Highlights
- ➤Credo (CRDO) will showcase optical and copper interconnect products at OCP Global Summit 2026
- ➤Micro-emitter optical backplane delivers up to 10x higher bandwidth than latest copper backplanes
- ➤1.6T ZeroFlap products target AI infrastructure connectivity across optical and electrical links
- ➤Toucan Gen6 PCIe AEC targets GPU-intensive AI workloads with real-time telemetry and fault isolation
- ➤Credo will present AI interconnect technologies and telemetry solutions across multiple OCP sessions
Expert Statements
Bill Brennan Wider, President and CEO of Credo
“Wider. Slower. Better: Optics That Can Beat Copper”
LK Bhupathi, AVP of Product at Credo
“Going Wide: Scalable and Reliable Optical Interconnects for AI Clusters”
Chris Collins, AVP of Sales & Optical Product Marketing at Credo
“More Signal, Less Noise: Improving AI Cluster Returns Through Standardized Transceiver Telemetry in the OCP Optics Reliability Workstream”
Rajan Pai, VP of Optical Solutions at Credo
“Extending Community SONiC for Advanced Optics Telemetry Aligned with OCP Standards”
Vishal Shah, VP of Product at Credo
“An Open Lightweight Serial Interconnect for Composable AI Architectures”
Allan Cantle, CEO of Nallasway
“An Open Lightweight Serial Interconnect for Composable AI Architectures”
Credo to Showcase Broad Portfolio of Connectivity Solutions for AI Scale-Out and Scale-Up Fabrics at 2026 OCP Global Summit
Credo Technology Group Holding Ltd (Credo) (NASDAQ: CRDO), an innovator in providing connectivity at scale through fast, reliable, and energy-efficient system solutions, will showcase its newest optical and copper interconnect products for scaling AI infrastructure at OCP Global Summit 2026, which takes place October 12-15 at the San Jose Convention Center.
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