Entegris Enters Silicon Carbide and Diamond-Enabled Thermal Management Materials Market for AI Advanced Packaging

Olivier Blachier, President, Materials Solution and SVP, Chief Innovation Officer at Entegris

“Growth in AI compute, from model training to inference, is intensifying power and heat-management demands in data centers.”

Olivier Blachier, President, Materials Solution and SVP, Chief Innovation Officer at Entegris

“We are excited to announce that Entegris is entering this fast-growing market to bring necessary innovation to meet our customers’ chip and package level materials demands.”

Olivier Blachier, President, Materials Solution and SVP, Chief Innovation Officer at Entegris

“Thermal management is emerging as a critical industry challenge. We believe the move from conventional heat-spreading materials to novel materials and engineered thermal interfaces will mark a major shift in semiconductor manufacturing.”

Olivier Blachier, President, Materials Solution and SVP, Chief Innovation Officer at Entegris

“Our goal is to facilitate better heat dissipation without compromising performance or reliability. We’re helping customers make that transition through materials innovation and integration at scale.”