Fabric.AI Engages Renowned Global Consulting Firm Kearney to Utilize Its World-Class Infrastructure and Supply Chain Expertise to Lead Commercialization Strategy for Neural I/o™ Optical Interconnect Platform
Key Highlights
- ➤Fabric.AI engages Kearney to accelerate Neural I/o commercialization strategy
- ➤Active sales discussions expected after working-hardware demonstrations in early 2027
- ➤Fabric.AI and Kopin signed NDAs with several semiconductor and data-center companies
- ➤Neural I/o uses MicroLED-based optical interconnects for AI data centers
Expert Statements
James Altucher, Independent strategic advisor to Fabric.AI
“Neural I/o™ addresses the two constraints that will define the next generation of AI data centers — how much data you can move, and what it costs in power to move it. We are already in confidential discussions with companies operating at the scale where those constraints bite hardest. Kearney’s role is to help us turn those conversations into commercial relationships, and to reach the semiconductor and infrastructure partners best positioned to bring this technology to market at scale. We anticipate active sales discussions beginning shortly after we demonstrate working hardware early next year.”
NEW YORK, NY, Oct. 06, 2026 (GLOBE NEWSWIRE) -- Fabric.AI (Nasdaq: FABC) (“Fabric.AI” or the “Company”), an AI infrastructure company developing a suite of fabless semiconductor technologies for next-generation AI factories, today announced that it has engaged Kearney, the global technology-focused management consulting firm, to apply its world-class infrastructure and supply chain expertise to accelerate and enhance the commercialization strategy for its Neural I/o™ MicroLED-based optical interconnect platform.
James Altucher, independent strategic advisor to Fabric.AI, commented, “Neural I/o™ addresses the two constraints that will define the next generation of AI data centers — how much data you can move, and what it costs in power to move it. We are already in confidential discussions with companies operating at the scale where those constraints bite hardest. Kearney’s role is to help us turn those conversations into commercial relationships, and to reach the semiconductor and infrastructure partners best positioned to bring this technology to market at scale. We anticipate active sales discussions beginning shortly after we demonstrate working hardware early next year.”
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