Fabric.AI Files Two Patent Applications Covering Fiber-Coupled and Connector-Free MicroLED Optical Interconnect, Developed with Kopin

NEW YORK, NY, Sept. 23, 2026 (GLOBE NEWSWIRE) -- Fabric.AI (Nasdaq: FABC) (“Fabric.AI” or the “Company”), an AI infrastructure company developing a suite of fabless semiconductor technologies for next-generation AI factories, today announced that it has filed two patent applications with the United States Patent and Trademark Office (USPTO) covering its micro-LED optical interconnect architecture.

Both applications derive from the same design choice: imaging an entire micro-LED array through a novel optical system, rather than aligning light channel by channel. Through their partnership, Fabric.AI and Kopin Corporation (Nasdaq: KOPN) are jointly developing MicroLED-based optical interconnect technology designed to address bandwidth and energy-efficiency constraints in next-generation AI data centers.