Fabric.AI Files Two Patent Applications Covering Fiber-Coupled and Connector-Free MicroLED Optical Interconnect, Developed with Kopin

Both applications derive from a single optical approach designed to hold assembly complexity flat as channel counts rise; Company remains on track to show first demonstration hardware in January 2027

NEW YORK, NY, Sept. 23, 2026 (GLOBE NEWSWIRE) -- Fabric.AI (Nasdaq: FABC) (“Fabric.AI” or the “Company”), an AI infrastructure company developing a suite of fabless semiconductor technologies for next-generation AI factories, today announced that it has filed two patent applications with the United States Patent and Trademark Office (USPTO) covering its micro-LED optical interconnect architecture.