GF unveils roadmap to deliver the world’s most advanced FD-SOI platform for Physical AI
Key Highlights
- ➤FDX Fusion manufacturing planned for 2028 at GF’s Dresden facility
- ➤First-generation FDX Fusion expected to deliver seven nanometer class digital performance
- ➤FDX Fusion expected to provide more than 2x density improvement over first-generation FDX
- ➤Demonstrator silicon targeted for early customer evaluation in early 2027
- ➤Initial process design kit release planned for mid-2027
Expert Statements
Ed Kaste, Senior vice president of GF’s CMOS business
“Physical AI is creating a new class of semiconductor requirements as intelligence moves beyond the cloud and into systems and devices that can process data in real time and interact seamlessly with the physical environment.”
Ed Kaste, Senior vice president of GF’s CMOS business
“The FDX Fusion platform extends GF’s FD-SOI roadmap with innovations across the substrate, transistor and interconnect stack, delivering a platform purpose-built for power-efficient Physical AI applications.”
Ed Kaste, Senior vice president of GF’s CMOS business
“Combined with our software-to-silicon capabilities and our expanding, resilient manufacturing footprint in Europe, FDX Fusion will position GF as the technology partner of choice to accelerate the scaling of Physical AI.”
Dr. Axel Kaschner, Senior Vice President, Business Unit Integrated Circuits, Mobility Electronics, Bosch
“GF’s FDX roadmap is an important step towards delivering the semiconductor platforms needed to bring sensing, control, connectivity and efficient edge intelligence together for the next generation of robotics and automation,”
Sébastien Dauvé, CEO of CEA-Leti
“We are delighted that GlobalFoundries has announced its next-generation ‘single-digit FD-SOI’ node, building on technology that CEA-Leti has been advancing for decades. Through the FAMES pilot line, CEA-Leti continues to shape the future European roadmap for FD-SOI and works every day to promote its adoption in a wide range of applications,”
Patrick Press, Executive Vice President External Wafer Manufacturing, Infineon
“Together, Infineon and GlobalFoundries are strengthening their collaboration to define and explore future 7nm class FDX Fusion technologies for next generation radar and wireless communication products,”
Lars Reger, Executive Vice President and Chief Technology Officer, NXP
“Physical AI is redefining what machines can do in the real world, creating new requirements for secure, reliable and low-latency processing at the edge. In Physical AI, trust and low power are paramount. NXP is encouraged by GF’s efforts to optimize its roadmap in service of making Trusted Physical AI a reality,”
Cedrik Neike, Member of the Managing Board of Siemens AG and President Digital Industries
“Europe's economy runs on silicon, one wafer at a time. Chips are critical for applications like robotics and connectivity, and for bringing AI into the physical world and industry. Achieving that vision requires close collaboration across the semiconductor, industrial automation, and software ecosystems. GF’s FDX Fusion roadmap strengthens the technology foundation for Physical AI by advancing capabilities that will help enable more intelligent, efficient, and resilient industrial systems,”
Karn Budhiraj, Vice President Supply Chain, Tesla
“The development and manufacturing of high-performance compute devices for edge processing is key to unlocking the next generation of advanced robotics and autonomous systems. GF’s technology roadmap reflects the type of semiconductor investment needed to bring physical AI to the masses,”
DRESDEN, Germany, Oct. 09, 2026 (GLOBE NEWSWIRE) -- GlobalFoundries (Nasdaq: GFS) (GF) today unveiled plans for its new FDX Fusion™ FD-SOI platform, purpose-built for the evolving requirements of Physical AI. Designed to be the world’s most advanced FD-SOI technology, FDX Fusion will bring leading features and performance for the unique requirements of STAC (Sense, Think, Act, Communicate) workloads. The company plans to commence manufacturing FDX Fusion technology in 2028 at its advanced facility in Dresden, Germany, reinforcing the site’s role as a strategic European hub for differentiated semiconductor technologies.
The first generation of FDX Fusion technology is expected to deliver seven nanometer class digital performance and is being developed from the ground up as the next major extension of GF’s FDX™ FD-SOI roadmap. By combining advanced substrate engineering, front-end transistor innovation and back-end interconnect and integration capabilities with exceptional RF performance up to 0.5 THz ft/fmax, analog and mixed-signal features, low-leakage operation, in-memory computing capabilities, embedded non-volatile memory and dense logic, FDX Fusion is expected to deliver more than 2x density improvement over first-generation FDX technology. This approach aims to provide customers with a comprehensive, intelligent platform for edge and Physical AI applications while reducing system complexity, latency and power consumption.
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