GlobalFoundries reaches agreement to establish U.S.-based supply of silicon interposers for advanced AI packaging
Key Highlights
- ➤GF and TSMC agree on U.S.-based silicon interposer manufacturing for CoWoS packaging
- ➤GF will expand Malta, New York capacity to support AI and high-performance computing demand
- ➤First U.S.-based silicon interposer source will support embedded deep trench capacitor components
- ➤Volume production at GF’s Malta site is expected to ramp during the first half of 2028
- ➤Agreement has an initial five-year term and framework for future capacity expansion
Expert Statements
Ed Kaste, Senior vice president of CMOS Business at GlobalFoundries
“Advanced packaging is becoming increasingly critical to delivering the performance, power efficiency and scale required for next-generation AI systems.”
Ed Kaste, Senior vice president of CMOS Business at GlobalFoundries
“By providing manufacturing service using GF’s trusted U.S. manufacturing footprint, we are creating a secure, scalable source of essential advanced-packaging elements that will help customers accelerate innovation and strengthen the semiconductor supply chain.”
MALTA, N.Y., Oct. 08, 2026 (GLOBE NEWSWIRE) -- GlobalFoundries (Nasdaq: GFS) (GF) today announced a manufacturing agreement with TSMC to establish a U.S.-based supply of silicon interposers for TSMC's CoWoS(®) advanced packaging ecosystem. Under the agreement, GF will provide manufacturing service to TSMC, and add fabrication capacity at its Malta, New York facility, supporting growing demand for high-performance computing and AI systems. The agreement provides a foundation to expand capacity over time as customer demand grows.
GF expects to expand capacity at its Malta facility and establish the first U.S.-based source of silicon interposers supporting advanced packaging technologies, including embedded deep trench capacitor components. The additional manufacturing capacity will provide greater scale and flexibility for delivering advanced packaging solutions across multiple product generations.
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