IBM and Siemens Collaborate on Research to Advance Nanostack Architecture

Huiming Bu, Vice President of Silicon Technology R&D, IBM

“Nanostack is a scalable transistor platform designed to shift device scaling from 2D to 3D, representing a new paradigm for the semiconductor industry and a path forward for the logic scaling needed to support AI and other emerging technologies over the coming decade”

Huiming Bu, Vice President of Silicon Technology R&D, IBM

“We are thrilled to work with Siemens as we continue to advance this technology and explore new approaches to extend angstrom-level scaling with nanostack.”

Ankur Gupta, Executive Vice President, EDA IC Portfolio, Siemens

“Scaling semiconductors into the angstrom era demands tightly coupled co-optimization between device physics, EDA design and manufacturing software, and manufacturing. As physical AI places extraordinary demands on silicon architecture, IBM's 3D nanostack design represents a pivotal leap forward”

Ankur Gupta, Executive Vice President, EDA IC Portfolio, Siemens

“Siemens' collaboration with IBM to advance virtual modeling, simulation, lithography, and design software optimizations needed to address physical limitations early and accelerate the development of these complex architectures is truly pioneering.”