Kulicke & Soffa Receives SEMI Award for North America for Breakthrough Fluxless Thermocompression Bonding Technology
PR Newswire•13/10/2026•13:00 ET
0
Key Highlights
- ➤Kulicke & Soffa (KLIC) wins SEMI’s 2026 Award for North America
- ➤Fluxless Thermo-Compression bonding enables interconnect pitches below 10 microns
- ➤FTC technology supports wafer-, substrate-, and panel-level manufacturing environments
- ➤APTURA™ platform highlighted in the company’s advanced packaging portfolio
Expert Statements
Raj Talluri, Chief Executive Officer of Kulicke & Soffa
“As semiconductor performance is now critically dependent on advanced packaging and heterogeneous integration, the industry’s ability to scale interconnect density efficiently and economically becomes more important than ever.”
Raj Talluri, Chief Executive Officer of Kulicke & Soffa
“We are honored to receive this recognition from SEMI. This award reflects the ingenuity, dedication, and relentless execution of our global teams, who continue to develop innovative solutions which enable customers to overcome the industry’s most complex manufacturing challenges.”
John Molnar, VP & General Manager, Advanced Solutions at Kulicke & Soffa
“This recognition validates our innovation-driven strategy of selecting differentiated technologies that solve real customer challenges.”
John Molnar, VP & General Manager, Advanced Solutions at Kulicke & Soffa
“By enabling hybrid-bonding-class performance with more accessible manufacturing, we are accelerating the adoption of advanced packaging solutions required for next-generation AI, high-performance computing, silicon photonics, and other rapidly growing semiconductor markets.”
Kulicke & Soffa Receives SEMI Award for North America for Breakthrough Fluxless Thermocompression Bonding Technology PR Newswire
Recognition Highlights Company's Leadership in Enabling Advanced Heterogeneous Integration and AI-Driven Semiconductor Innovation
Get started
Create a free account to read the full story.