nVent and AMD Collaborate on Cooling for AMD Helios Rackscale Solution
Globe Newswire•13/10/2026•08:00 ET
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Key Highlights
- ➤nVent (NVT) and AMD collaborate on rack-level cooling for AMD Helios
- ➤nVent adds DC-powered rear door heat exchanger to Helios platform
- ➤Solution supports scaling from a single rack to large AI deployments
- ➤First integrated cooling solution preview set for OCP Global Summit
Expert Statements
Eric Osborn, Vice President and General Manager of Data Solutions, Cooling & Power at nVent
“This collaboration brings nVent's cooling expertise to one of the leading AI platforms in the industry”
Eric Osborn, Vice President and General Manager of Data Solutions, Cooling & Power at nVent
“We are designing for the platforms our customers are building on, and working closely with AMD is how we make sure the fit is right.”
Ravi Pendekanti, Corporate Vice President, Data Center Solutions Business Group, AMD
“The rack, not any single component within it, has now become the unit of deployment; and compute, networking, software, power and cooling must operate as one system”
Ravi Pendekanti, Corporate Vice President, Data Center Solutions Business Group, AMD
“AMD Helios brings those elements together in an open, standards-based architecture designed to help customers scale from a single rack to large AI factories with long-term flexibility.”
Ravi Pendekanti, Corporate Vice President, Data Center Solutions Business Group, AMD
“Our collaboration with nVent expands the cooling options available for AMD Helios, helping operators bring high-density AI infrastructure online across a broader range of data center environments.”
nVent will add liquid and air cooling solution to AMD rack-scale AI platform to create a fully integrated system for large AI workloads
The companies will unveil a first look of the open-source solution at the OCP Global Summit
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