Qnity Extends Thermal Management Solutions for Advanced Memory Cooling for AI Data Centers
Business Wire•13/10/2026•09:00 ET
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Key Highlights
- ➤Qnity introduced two memory-cooling solutions using Laird Graphite-over-Foam and Thermal Interface Material technologies
- ➤New solutions target high-density DDR5 DIMM modules in AI servers and high-performance computing
- ➤Qnity solutions address thermal performance, dimensional tolerances, assembly, serviceability, and reliability
- ➤Modern server platforms can deploy up to 48 DDR5 memory modules in densely packed DIMM rows
Expert Statements
Chuck Xu, President, Interconnect Solutions, Qnity
“As AI workloads place greater demands on memory bandwidth, capacity and speed, keeping memory modules cool is critical to sustaining performance and reliability”
Chuck Xu, President, Interconnect Solutions, Qnity
“We’re working side by side with customers to extend the Laird thermal expertise they already rely on to advanced memory cooling, so they can improve reliability, simplify assembly, and scale AI infrastructure faster.”
Qnity Extends Thermal Management Solutions for Advanced Memory Cooling for AI Data Centers
New Laird™ Graphite-over-Foam and Thermal Interface Material solutions expand Qnity's thermal portfolio, helping engineers cool high-density memory modules in AI data centers
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