Qnity Showcases Materials Innovation Powering the Next Leap in Electronics at TPCA Show 2026
Business Wire•05/10/2026•09:00 ET
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Key Highlights
- ➤Qnity (Q) will showcase advanced materials for AI, packaging, interconnects, and thermal management
- ➤Qnity will present copper metallization technologies for AI-driven high-density interconnects
- ➤Qnity will demonstrate thermal management solutions for thin, high-power AI data-center PCBs
- ➤Approximately 1,500 Qnity team members support Taiwan technical, R&D, and manufacturing operations
Expert Statements
Chuck Xu, President, Interconnect Solutions, Qnity
“AI is pushing the limits of printed circuit boards — more power, more heat and denser interconnects in more complex designs”
Chuck Xu, President, Interconnect Solutions, Qnity
“Those challenges are solved at the materials level. At TPCA Show and the IMPACT Conference, we'll show how our plating chemistry, circuit imaging, flexible circuit materials and thermal management solutions help customers build AI systems that are faster, more reliable and with improved resource efficiency — and we'll do it the way we always do, working side by side with our customers as a co-innovator.”
Qnity Showcases Materials Innovation Powering the Next Leap in Electronics at TPCA Show 2026
Driving higher-performance, energy-efficient AI through innovations in advanced packaging, interconnects, and thermal management
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