Semtech Advances Next-Gen AI Optical Interconnects for XPO

Semtech’s 200G/lane modulator driver and TIA ICs accelerate the industry's transition to XPO for AI network infrastructure

Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductors powering AI data center networking and intelligent, connected Internet of Things (“IoT”) devices worldwide, today announced its membership in the eXtra-dense Pluggable Optics Multi-Source Agreement (XPO MSA), an industry initiative to enable high-bandwidth optical interconnects for AI network infrastructure. As a technology partner to the MSA, Semtech brings a broad portfolio of 200G/lane modulator driver and transimpedance amplifier (TIA) integrated circuits designed to support XPO transceiver development and volume deployment.