Socionext Expands Agentic AI to Advanced, Large-Scale SoC Physical Design

Chin-Chi Teng, Senior vice president and general manager, Digital and Signoff Group at Cadence

“As semiconductor design complexity grows, engineering organizations need better ways to capture and reuse expertise across projects and teams.”

Chin-Chi Teng, Senior vice president and general manager, Digital and Signoff Group at Cadence

“Socionext’s implementation demonstrates how the open and extensible InnoStack AI Super Agent enables customers to integrate their own methodologies and proprietary engineering knowledge into AI-assisted design environments.”

Chin-Chi Teng, Senior vice president and general manager, Digital and Signoff Group at Cadence

“Together, Cadence’s technology and Socionext’s engineering expertise make valuable design knowledge more accessible and actionable across the organization.”

Hisato Yoshida, President and COO of Socionext

“Socionext has already incorporated AI into front-end design activities and is applying AI-driven design to the physical design of a large-scale 3nm SoC.”

Hisato Yoshida, President and COO of Socionext

“Building on these efforts, we are advancing our AI-driven design capabilities through our collaboration with Cadence and applying the Cadence InnoStack AI Super Agent to SoC development projects.”

Hisato Yoshida, President and COO of Socionext

“We expect to achieve up to 5X overall productivity gains through Cadence’s agentic AI workflow.”

Hisato Yoshida, President and COO of Socionext

“By combining our accumulated design knowledge, methodologies, and engineering experience with Cadence technology, we aim to improve design quality and enable engineers to focus on higher-value innovation across the entire SoC development flow.”