Back to news

Supermicro Expands Integrated Open Compute Project Portfolio to Accelerate Rack-Scale AI Data Center Deployments

PR Newswire•13/10/2026•09:05 ET
2

Key Highlights

  • ➤Supermicro expands OCP portfolio across rack-scale AI systems, power, networking, and cooling
  • ➤DCBBS integrates compute, power, networking, cooling, software, and services for rack-scale deployments
  • ➤RDHx cooling solutions span 10 kW to 120 kW capacity for higher-density data centers
  • ➤NVIDIA Spectrum-X Ethernet Photonics is in production with 102.4 Tb/s switching capacity
  • ➤250 kW 4U in-rack CDU supports high-density AI racks with 45°C warm-water cooling

Expert Statements

Charles Liang, President and CEO of Supermicro

“The AI boom is redefining how data centers are designed, built, and deployed, and Supermicro is leading this transformation with DCBBS”

Charles Liang, President and CEO of Supermicro

“By integrating compute, networking, power, advanced cooling, software, and services into validated rack-scale solutions, we help customers simplify complexity and accelerate the path from innovation to production.”

Charles Liang, President and CEO of Supermicro

“DCBBS enables customers to reduce TTM and TTO by delivering essential AI infrastructure faster and more efficiently.”

Dirk Van Slyke, Vice President of Marketing, OCP

“Customers need open, flexible infrastructure that can scale with the rapidly evolving demands of AI while fitting the realities of their data centers,”

Dirk Van Slyke, Vice President of Marketing, OCP

“By bringing OCP-accepted systems, racks, power and cooling together in validated rack-scale solutions, Supermicro is helping customers simplify integration, maximize facility capacity and efficiency, and accelerate the deployment of production AI infrastructure.”

Supermicro Expands Integrated Open Compute Project Portfolio to Accelerate Rack-Scale AI Data Center Deployments PR Newswire

SAN JOSE, Calif., Oct. 13, 2026 * Integrated Open Compute Project (OCP) based portfolio spans rack-scale AI/HPC systems, ORv3 and ORW racks, 48V DC power, networking, and liquid cooling solutions to enable higher-density compute in existing and new data centers * Portfolio extends from infrastructure to intelligent operations with DCBBS Coolants, in-rack CDUs, switches, and Supermicro System Management Software Suite for infrastructure management * Supermicro DCBBS brings these OCP-based technologies together into integrated rack-scale solutions, simplifying and speeding deployment across compute, power, networking, and cooling for a faster Time-to-Online (TTO) SAN JOSE, Calif., Oct. 13, 2026 /PRNewswire/ -- Super Micro Computer, Inc. (NASDAQ: SMCI), an AI, Enterprise, Storage, and 5G/Edge Total IT Solution Provider featuring Data Center Building Block Solutions® (DCBBS) (https://edge.prnewswire.com/c/link/?t=0&l=en&o=4796123-1&h=1945099949&u=https%3A%2F%2Fwww.supermicro.com%2Fen%2Fsolutions%2Fdcbbs&a=Data+Center+Building+Block+Solutions%C2%AE+(DCBBS)), today announced an expanded portfolio of Open Compute Project Accepted™ systems, racks, and rear door heat exchangers (RDHx). Supported by DCBBS, the solutions portfolio can be incorporated into complete end-to-end rack- and cluster-scale deployments.

Get started

Create a free account to read the full story.

Sign Up

Already have an account? Log in