Teradyne Introduces Titan HP Platform with Burn-In Capabilities for Advanced AI Data Center Devices
Business Wire•06/10/2026•09:00 ET
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Key Highlights
- ➤Teradyne (TER) introduced production-ready Titan HP burn-in capabilities for advanced AI devices
- ➤Titan HP is available today and deployed in production
- ➤Per-device thermal control and kilowatt power delivery support high-power AI reliability testing
- ➤Asynchronous slot architecture prevents one device’s long stress run from idling others
- ➤Teradyne says the platform can lower test costs and improve time to market
Expert Statements
Jason Zee, Vice president and general manager of the Integrated Systems Test division at Teradyne
“Our customers are being asked to ship high-power AI silicon at reliability levels that used to belong to automotive”
Jason Zee, Vice president and general manager of the Integrated Systems Test division at Teradyne
“Moving reliability stress testing onto a system level test platform means optimized reliability, which can lower cost of test, improve time to market and deliver better data on every device shipped.”
Teradyne Introduces Titan HP Platform with Burn-In Capabilities for Advanced AI Data Center Devices
Chipmakers can lower cost of test, factory floor space, and time to market for high-power AI, automotive, and other high-reliability devices.
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