Teradyne Introduces UltraFLEXplus S Series for Edge AI Applications
Business Wire•12/10/2026•09:00 ET
0
Key Highlights
- ➤Teradyne launches UltraFLEXplus S series for edge AI semiconductor testing
- ➤UltraFLEXplus S24 debuts as a 24-slot engineering and production system
- ➤Single-module S series targets high-mix, variable-volume manufacturing economics
- ➤S series reuses UltraFLEXplus Q instruments, IG-XL software, and test libraries
Expert Statements
Roy Chorev, Vice president and general manager of the Compute Test division at Teradyne
“Floor space is one of the biggest hidden costs in high-mix manufacturing, and UltraFLEXplus S is built to optimize it”
Roy Chorev, Vice president and general manager of the Compute Test division at Teradyne
“As AI moves from the data center to the edge, customers need a platform that fits their facilities today and scales with them tomorrow, without giving up the rigor and reliability they already trust from UltraFLEXplus”
Teradyne Introduces UltraFLEXplus S Series for Edge AI Applications
New Series of Testers Extend the UltraFLEXplus Architecture to Deliver Superior Floor Space Economics for High-Mix, Variable-Volume Manufacturing
Get started
Create a free account to read the full story.