Trane Technologies Launches LiquidStack CDU 2.X for Faster, More Flexible AI Cooling Deployments
Key Highlights
- ➤LiquidStack CDU 2.X supports flow up to 3750 lpm at 3.5 bar
- ➤CDU 2.X supports current and emerging AI silicon platforms
- ➤CDU 2.X supports next-generation GPU platforms, including NVIDIA Vera Rubin
- ➤LiquidStack CDU 2.X available for pre-order; shipments begin Q2 2027
- ➤LiquidStack GigaModular CDU platform expands capacity to 14 MW
Expert Statements
Scott Smith, General Manager of LiquidStack, Trane Technologies
“Operators need cooling infrastructure that can adapt as GPU platforms and rack densities evolve.”
Scott Smith, General Manager of LiquidStack, Trane Technologies
“CDU 2.X combines the performance and flexibility customers need today with the headroom to prepare for what comes next, allowing them to configure cooling around their facility and deployment strategy rather than designing the facility around the CDU.”
SWORDS, Ireland, Sept. 29, 2026 (GLOBE NEWSWIRE) -- Trane Technologies (NYSE: TT), a global climate innovator, today at Yotta 2026 announced the release of the LiquidStack™ CDU 2.X platform, an architecture-agnostic coolant distribution unit (CDU) designed to provide the cooling performance and deployment flexibility required for rapidly evolving AI infrastructure. The new platform helps reduce redesign risk and simplify deployment for data center operators and reflects Trane Technologies’ continued investment in advanced thermal management solutions for high-density data center environments.
As the GPU landscape continues to shift and accelerate, flexibility has become critical for both the short and long-term viability of AI, high-performance computing and hyperscale data centers. This new platform’s single CDU design solves for this need by supporting today’s industry-leading AI hardware and emerging solutions alike. With flow capability of up to 3750 lpm at 3.5 bar, CDU 2.X is designed to meet the cooling performance of today’s GPU platforms while providing available headroom for next-generation platforms as rack densities increase.
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