TTM Technologies Announces $400 Million in Planned Strategic Investments to Accelerate AI Infrastructure Capacity in China and Malaysia
Key Highlights
- ➤TTM plans $400 million in AI infrastructure capacity investments across China and Malaysia
- ➤Investments add to TTM’s previously disclosed $1.2 billion 2025-2029 commitment
- ➤Expansion targets advanced N+M asymmetrical interconnect manufacturing technology products
- ➤TTM is using brownfield expansions to rapidly bring AI-specific PCB capacity online
Expert Statements
Edwin Roks, President and CEO of TTM Technologies
“The AI boom has increasingly placed significant demands for capacity within the AI hardware supply chain. TTM anticipates this market to remain highly dynamic and we will continue to work closely with our customers to define additional expansions as required. The rapid growth in demand requires us to make rapid capacity increases across several of our facilities.”
Jim Walsh, Chief Operating Officer of TTM Technologies
“By leveraging our existing footprint in China and Penang to scale our advanced technology, we believe we are shortening the time between investment and revenue such that our customers can scale without unnecessary or prohibitive bottlenecks.”
SANTA ANA, Calif., Oct. 12, 2026 (GLOBE NEWSWIRE) -- TTM Technologies, Inc. (NASDAQ: TTMI) (“TTM”), a leading global manufacturer of technology products, including mission systems, radio frequency ("RF") components, RF microwave/microelectronic assemblies, and technologically advanced interconnect products, including printed circuit boards ("PCBs") and substrates, announced today a $400 million investment plan to expand capacity across four key facilities in China and its strategic southeast Asia plant in Penang, Malaysia. This expansion initiative represents incremental investments to the previously disclosed commitment to invest $1.2 billion through the 2025-2029 timeframe and is buttressed by ongoing discussions with our long-standing customer partners indicating expected demand increases.
The planned investments are dedicated to supporting the surge in Artificial Intelligence (“AI”) infrastructure demand, primarily scaling TTM’s advanced N+M asymmetrical, interconnect manufacturing technology products. This expansion underscores TTM’s commitment to its shareholders to capitalize on aggressive organic growth opportunities within the AI sector, with the goal of ensuring the company’s customers have access to both the critical capacity and innovative capabilities of TTM’s advanced interconnect technologies. To meet the urgent needs of data center infrastructure providers, hyperscalers, and networking customers, TTM is bypassing more time-consuming "greenfield" construction approaches in favor of its brownfield approach for strategic expansions. This “rapid ramp” approach entails optimizing existing operational space and integrating cutting-edge equipment to bring AI-specific PCB production capacity online very efficiently.
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