UMC and AP Memory Collaborate to Enable Advanced Power Delivery Solutions for AI and HPC Systems
Key Highlights
- ➤S-SiCap Gen2D designs complete tape-out and initial functional validation in Q3 2026
- ➤UMC and AP Memory target system-level reliability testing in substrate packages
- ➤Collaboration addresses AI and HPC power delivery through embedded silicon capacitors
- ➤UMC and AP Memory explore capacitor-embedded interposers and landside capacitors
Expert Statements
GC Hung, Senior Vice President of UMC
“The growth of AI and HPC is driving a fundamental shift in power delivery – from board-level towards increasingly vertical power integration on the chip-level. UMC is offering robust power delivery solutions, including our DTC technology, which enables high-density capacitance to be placed closer to the computing die for more stable power delivery. By partnering with AP Memory, we are helping to bring scalable solutions to the market to solve the critical power bottleneck challenges as AI infrastructure continues to evolve.”
Ivan Hong, President of AP Memory
“The successful tape-out and initial wafer validation of our customized S-SiCap™ products using DTC technology represents an important milestone in demonstrating the flexibility and manufacturability of AP Memory's S-SiCap™ design. By working with UMC, we are providing our customers a total solution, from product design to wafer manufacturing.”
UMC and AP Memory Collaborate to Enable Advanced Power Delivery Solutions for AI and HPC Systems PR Newswire
HSINCHU, Oct. 22, 2026 /PRNewswire/ -- United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ("UMC") and AP Memory (TWSE: 6531) today announced a technology and manufacturing collaboration to advance power delivery solutions for AI and high-performance computing (HPC) systems. This partnership combines UMC's deep trench capacitor (DTC) foundry technology and scalable wafer manufacturing with AP Memory's silicon capacitor designs and system-level integration to address the power efficiency challenges of next-generation data centers.
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