Vishay Intertechnology Releases New Top-Side Cooling Mount Thick Film Power Resistor in Compact TO-263 (D²PAK) Package
Key Highlights
- ➤Vishay Intertechnology (VSH) introduced Automotive Grade D2TO35S power resistor
- ➤D2TO35S delivers 35 W power dissipation at 25 °C in TO-263 package
- ➤Top-side cooling enables up to nine times greater power dissipation with heatsink
- ➤Samples and production quantities available now; lead times are fourteen weeks
MALVERN, Pa., Sept. 29, 2026 (GLOBE NEWSWIRE) -- Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new Automotive Grade top-side cooling mount thick film power resistor. Designed for automotive applications, the Vishay Sfernice D2TO35S improves thermal performance and reduces board space requirements, while delivering high power dissipation of 35 W at 25 °C in the surface-mount TO-263 (D²PAK) package.
As thermal constraints increasingly become the primary system design limitation, many power components are transitioning from PCB-based cooling to top-side cooled architectures. By transferring heat directly to a heatsink, the D2TO35S released today enables up to nine times greater power dissipation than standard PCB-mounted devices when paired with an appropriate heatsink. Its compact, surface-mount design allows designers to increase power dissipation within the same footprint or provide the same functionality in a smaller footprint, while lowering PCB temperatures, reducing thermal stress on neighboring components, and improving overall system reliability.
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